H907-HF-D低硬度单组份环氧树脂粘接胶 70D磁芯胶变压器电感胶水 低应力中柱胶

H907-HF-D系非溶剂型单组份环氧低卤树脂产品，具有低线膨胀系数及耐高温、抗冲击、耐震动、硬度透中、柔韧性好等特性。广泛应用于各类电子元器件、电工电器、机电五金、磁性元件、光电产品、汽配组件等之粘接固定，对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接，有优异的粘接强度；固化物TG点较低，在高温环境中具有较好的柔软性，收缩应力较普通硬胶低；推荐用于电机马达、高低频变压器的铁芯或磁芯粘接及骨架固定。

外观及物性：

外观               粘稠膏状体 

 颜色               黑色

比重（25℃） 1.45-1.55   

粘度（25℃） 35000-65000 CPS

保存期限        25度2个月，5度3个月

包装              1KG或5KG

固化条件：   120℃/1.5-2小时；            

固化后特性

硬    度         Shore D       65-78   

体积电阻        Ω-cm        4.7×1013

热线膨胀系数      6.6×10-5/℃       

表面电阻        Ω-cm         5.8×1012 

抗弯强度          kg／mm2   5.5   

绝缘破坏电压    kv/mm      16-18

磁芯与磁芯粘接力    大于15KG

H907-hf-d is a non solvent one component low halogen epoxy resin with low coefficient of linear expansion, high temperature resistance, impact resistance, vibration resistance, medium hardness and good flexibility. Widely used in all kinds of electronic components, electrical appliances, mechanical and electrical hardware, magnetic components, optoelectronic products, auto parts and other components of the bonding, for metal, ceramics, glass, fiber products and rigid plastic between the package bonding, has excellent bonding strength; The TG point of the cured product is lower, it has better flexibility in high temperature environment, and its shrinkage stress is lower than that of the common hard adhesive; Recommended for motor, high and low frequency transformer core or core bonding and skeleton fixation.