Single Epoxy
H907-DH, single component thermal conductive epoxy adhesive, thermal conductive adhesive, adhesive
CHARATERISTICS
The non-solvent H907-DH is a one-component thermal conductivity epoxy adhesive, with low linear expansibility, good high temperature resistance, excellent shock and vibration resistance, high binding strength and hardness when cured.
Appearance(uncured) | Black, or grey paste |
Specific Gravity(25°C) | 2.0-2.3 |
Viscosity(25°C) | 50000-90000 cps |
Shelf life | 2 months(25 oC) or 3 months(5 oC) |
Package | 1 kg, 5 kg |
TYPICAL APPLICATION
Recommend the bonding and fixation of electric motors, circuit components, electronic and photoelectric components.
Good bonding force and performance with the insulation application among metal, ceramics, glass, fibre and hard plastics.
PERFORMANCE
Typical properties cured for 1-1.5 h @ 120°C
Hardness | Shore D | 85-87 |
Volume resistance | Ω-cm | 4.5E15 |
Surface resistance | Ω-cm | 5.5E14 |
Heat resistance | oC | 130-150 |
Bending strength | kg/mm2 | 12 |
Tensile strength | kg/mm2 | 6 |
Thermal conductivity | W/m/K | 0.8-1.2 |
Note: The material specification tests include selected QC test parameters considered appropriate to specifications
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