H907-TP-8, Type-c adhesive, Type-c connector sealant, sealing adhesive, epoxy resin adhesive

CHARATERISTICS

The H907-TP-8 is a one-component high ductility and strength epoxy adhesive, with high ductility and hardness, low interior tension, excellent bonding force, and sealability, high temperature resistance, good electrical performance, excellent shock and vibration resistance when cured. Low viscocity and good levelling property for better handling@room temperature.

TYPICAL APPLICATION

Bonding and sealing of different eletric and electronic components, machanical and magnetic componenets, photoelectronic and automotic sub-units, type-C connector, terminal, etc.

High bonding force among metal, ceramics, glass, fibre, plastics substrates.

PERFORMANCE

Typical properties cured for 1-1.5h @ 115-120°C / 0.5-1h@150°C (tunable)

Note: The material specification tests include selected QC test parameters considered appropriate to specifications for customer use.

STORAGE

Seal perservation in low-temp, cool and dry place. Expired product only can be used after passing the performance test if needed.