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H907-HF-G低应力单组份环氧胶 不拉裂磁芯不影响电感量 内应力低环氧树脂胶水磁芯胶

华创新材2021-05-20 09:58:51Single Epoxy1075source:Epoxy resin adhesive | high-temperature adhesive | potting adhesive | thermal conductive adhesive | structural adhesive | UV adhesive | AB adhesive |glue |sealant|- Huachuang Materials

H907-HF-G是非溶剂型低应力单组份环氧低卤树脂产品,具有低线膨胀系数及耐高温、抗冲击、耐震动、硬度高、高韧性等特性。广泛应用于各类电子元器件、电工电器、机电五金、磁性元件、光电产品、汽配组件等之粘接固定,对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接,有优异的粘接强度;固化物TG点较低,在高温环境中具有较好的柔韧性,收缩应力较普通硬胶低;推荐用于电机马达、高低频变压器的铁芯或磁芯粘接及骨架固定。

外观及物性

外观               粘稠膏状体  

颜色                     黑色                

比重(25℃) 1.45-1.55                  

粘度 (25℃)   45000-65000 cps

保存期限       25度2个月,5度3个月    

QQ图片20200804103231.jpg 

包装               1KG或5KG  

固化条件:   120℃/1-1.5小时;             

固化后特性

硬    度         Shore D       78-85     

抗拉强度          kg/mm2      5        

热线膨胀系数      65×10-5/℃   

接着强度        铁芯对铁芯   大于25kG

H907-hf-g is a non solvent type low stress single component epoxy low halogen resin product, which has low linear expansion coefficient and high temperature resistance, impact resistance, vibration resistance, high hardness and high toughness. It is widely used in the bonding and fixing of various electronic components, electrical and electrical appliances, electromechanical hardware, magnetic components, photoelectric products, auto parts components, etc. it has excellent bonding strength for the packaging and bonding between metal, ceramics, glass, fiber products and hard plastic; The TG point of the solidified material is lower, and it has better flexibility in high temperature environment, and the shrinkage stress is lower than that of the ordinary hard glue; It is recommended to be used for bonding and fixing the frame of the iron core or magnetic core of motor motor and high and low frequency transformer.

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