H907-HF-Z-D导热型磁芯中柱胶填充胶 单组份热固化软性环氧树脂胶粘剂 华创胶水

H907-HF-Z-D系单组份含环氧树脂高弹性导热胶粘剂，广泛应用于各类电子元器件、电工电器、机电五金、磁性元件、光电产品、汽配组件等之粘接固定，对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接，有优异的粘接强度；磁芯中柱填充；在高温下具有较高之触变性，硬化后固化物具有很高的弹性、良好的粘接性能、导热散热性好、优良的电气性能以及优越的防振动性能。

外观及物性：

外观               粘稠膏状体 

 颜色              黑色

比重（25℃） 1.4-1.5

粘度（25℃） 40000-60000 CPS

保存期限        25度2个月，5度3个月

包装              1KG或5KG

固化条件：  115- 120度1.5-2小时

固化物特性：

体积电阻           Ω-cm         5.2×1013 

热线膨胀系数   cm/cm/℃    5.5×10-6/℃ 

接力强度         kg／cm2       25-35  

硬    度            SHORE D      45-55

铁芯与铁芯粘接强度   KG         > 15         

导热率              W／M.°C       0.6

H907-hf-z-d is a one component epoxy resin containing high elastic thermal conductive adhesive, which is widely used in the bonding and fixation of various electronic components, electrical appliances, mechanical and electrical hardware, magnetic components, photoelectric products, auto parts, etc. it has excellent bonding strength for the packaging and bonding between metal, ceramics, glass, fiber products and rigid plastic adhesives; The magnetic core is filled with the middle pillar; It has high thixotropy at high temperature. After hardening, the cured product has high elasticity, good adhesion, good thermal conductivity, excellent electrical performance and excellent anti vibration performance.