H907-K低温快固化单组份环氧树脂胶 结构粘接胶电子胶 电机转子胶 80度固化epoxy

H907-K系非溶剂型单组份低温快固化环氧树脂产品，具有低线膨胀系数及耐高温、抗冲击，耐震动，硬度高等特性。广泛应用于电子元器件及工艺品、礼品的粘接固定，对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接，有优异的粘接强度；推荐用于线路板电子元器件、医疗产品、一次性注射器针头、各种微电子产品、光电产品、电机马达、电感线圈、高低频变压器的铁芯或磁芯及其它各类需要低温固化或高温快固化的产品粘接固定。 

外观及物性

外观                粘稠膏状体 

颜色                 黑色、灰色、乳白色               

比重（25℃）    1.4-1.5 

粘度 （25℃）    35,000-45,000 cps   

固化条件：        80-90℃/30-60分钟，120度5-10分钟；        

固化后特性

硬度                Shore D         85-95

热线膨胀系数      6.7×10-5/℃

表面电阻          Ω-cm           5.5×1013  

抗弯强度          kg／mm2     11.1

 绝缘破坏电压   kv/mm        18-20

抗拉强度          kg/mm2         5.8

耐温范围          150-180℃

H907-k is a non solvent one component low temperature fast curing epoxy resin product. It has the characteristics of low linear expansion coefficient, high temperature resistance, impact resistance, vibration resistance and high hardness. It is widely used in the bonding and fixation of electronic components, handicrafts and gifts. It has excellent bonding strength for the packaging and bonding of metals, ceramics, glass, fiber products and hard plastics. It is recommended to be used in circuit board electronic components, medical products, disposable syringe needle, various micro electronic products, photoelectric products, motor, inductance coil, high and low frequency transformer The iron core or magnetic core and other products requiring low-temperature curing or high-temperature fast curing shall be bonded and fixed.