Epoxy 第6页
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The Advantages of Epoxy Resin Potting for Electronic Components
Introduction:Epoxy resin potting is a widely used technique for protecting and encapsulating electronic components. It involves the use of epoxy resin potting compounds, which offer numerous advantages in terms of protection, insulation, and durability. In thi...
Epoxy Resin PottingEpoxyResinPotting adhesiveElectronic Components -
Understanding Epoxy Resin Potting Compounds: A Comprehensive Guide
Understanding Epoxy Resin Potting Compounds: A Comprehensive GuideIntroduction:Epoxy resin potting compounds play a crucial role in the protection and encapsulation of electronic components. These compounds are widely used in various industries, including elec...
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H907-DH高导热单组份环氧树脂胶粘胶 Epoxy热固化耐高温高强度导热结构胶
H907-DH系非溶剂型单组份导热型环氧树脂产品,具有低线膨胀系数及耐高温、抗冲击、耐震动、粘接强度高、硬度高、导热性好等特性。广泛应用于各类电子元器件、电工电器、机电五金、光电饰品、汽配组件等之粘接固定,对于金属、陶瓷、玻璃、纤维制品及硬质塑胶之间的封装粘接有优异的粘接强度;推荐用于电机马达、电路元器件、电器组件、光电元件等粘接固定。 外观及物性外观 粘稠状体 ...
H907-DH高导热单组份环氧胶粘胶Epoxy热固化耐高温导热结构胶 -
环氧树脂复台材料的组成成份都有哪些?Epoxy resin composite
环氧树脂复台材料的组成 环氧树脂复合材料是由环氧树脂基体、增强材料及二者的界面层所组成。 (1)环氧树脂基体 它是环氧树脂胶液的固化物。环氧树脂胶液是由环氧树脂、固化剂以及促进剂、改性剂、稀释剂、偶联剂和其他助剂组成。根据不同的使用及工艺要求进行选配。 (2)增强材料多采用纤维及其织物,以及微粒状(粉状)材料。增强效果一般随增强材料长径比的增大而增大。微粒材料的增强效果较低,多用于功能性的复合,如...
Epoxy resin compositeEpoxy resinEpoxy环氧树脂复合材料环氧复合材料